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.-_ prepared by: date: -.-.. !r--. *? ,, - spec.no. ..- __ dg989001 hat--/ /w% sw\ .?i issue ~ nov/ioi%l --- i il 8. )t3&cmrw . .._ -,@e-- * . . _. ,? 15 pa& !? ;.?;: approved by: electronic components group rekese~i%t=wejx@io+ ry/bty?/?y; ?$f sharp corporation 7 z2gjgil?ci specification opto-electronic devices division device specification for light emitting diode model no. lt 1 zr95a series 1. these specification sheets include materials protected under the copyright of sharp corporation (?sharp?). please do not reproduce or cause anyone to reproduce them without sharp?s consent. 2. when using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (precautions) (1) this products is designed for use in the following application areas; r * oa equipment * audio visual equipment * home appliance * telecommunication equipment (terminal) * measuring equipment * tooling machines * computers i if the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; l * transportation control and safety equipment (aircraft, train, automobile etc.) * traffic signals * gas leakage sensor breakers * rescue and security equipment * other safety equipment i (3) please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; i * space equipment * teleconmumication equipment (for trunk lines) * nuclear power control equipment * medical equipment 1 (4) please contact and consult with a sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. please contact and consult with a sharp sales representative for any questions about this product. date: jl/av /4/ /ppl? customers approval presented by: 4m , m.katoh, date: department general manager of engineering dept.,111 opto-electronic devices division by: electronic components group sharp corporation
dg98900 1 nov/10/98 page .? ltlziwa series i? ----q5 -; ?73 : -? - e-3 ;-.. -ii . . . . ..,i -..- -.__*_ -3 -------.2 ltlzr95a series snecification 1. application this specification applies to the light emitting diode device model no. ltlzr95a series. (algainp chip led device) 2. outline dimensions andterminalconnections .**..*.-...-.-...*--.? refer to the attached sheet page 2. 3. ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..refertotheattachedsheetpage3. 3- 1. absolute maximum ratings 3-2. electra characteristics 3-3. optical characteristics 3-4. luminous intensity rank 4.characteristicsdiagrams .-..-..-.....-.-......-.....--.....-... refer to the attached sheet page 4-7. 5. reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..referto~eafiachedsheetpage8. 5- 1. test items and test conditions 5-2. failure judgement criteria 6. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..refertotheattachedsheetpage9. 6- 1. inspection method 6-2. description of inspection and criteria 7. taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 10-13. 7- 1. taping 7-2. label 7-3. dampproof package 8. soldering . . . . ..*.............................................. refer to the attached sheet page 14. 8- 1. reflow soldering 8-2. manual soldering 8-3. dip soldering method 9. precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 15. 9- 1. precautions matters for designing circuit 9-2. cleaning method 10. environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . refer to the attached sheet page 15. lo- 1. ozonosphere destructive chemicals. 10-2. bromic non-burning materials
. 2. outline dimensions and terminal connections mark p \ \ \ . q) 0. -l- -----l--- -------- . 7 , i 0 anode / @ cathode / i ote. . it is not include the flash in this dimension. !. pin connection @ anode ;. unspecified tolerance to be rfr0.2 @ cathode ------..~~8900 1 1 nodlo/ unit scale applicable model drawing no. mm free i ltlzr95a series 51009001
3. ratings and characteristics (notel) duty ratio=l/lo,puke width=o. lms (note2) manual soldering max.3second 3-2. electra characteristics parameter forward voltage reverse current terminal capacitance symbol conditions min. typ. max. vf 1$=2orl4 (2.2) 2.6 ir vr4v 100 ct v=ov,+1mhz - 60 - (ta-25c) unit v pa pf luminous intensity rank 200 1 g 1 h 1 i j 1 j 1 ltlzr95a 1 bbiflgt (note3)measured by sharp egqg model550(radiometer/photometersystem) 623 i 618 644 635 3-4.luminous intensity rank rank : luminous intensity i rank : luminous intensity b : 4.8 - 9.2 / e : 43 - 84 a : 6.9 - 13.2 f : _ 62 - 121 a ? : 10 - 19 g : 89 - 174 b : 14 - 28 1 h : 128 - 250 c : 21 - 40 / i : 185 - 360 d : 30 - 58 / j : 266 - 518 unit mcd condition ie2oma (ta=25?c) tolerance:+15%
4 characteristics diagrams ltlzg95a relative luminous intensity vs. forward current (ta=25%) 0.1 1 10 loo 0.1 1 10 100 forward current idma) forward current i,(ma) forward current vs. forward voltage (~~25% 1.7 2.2 forward voltage v,(v) relative luminous intensity vs. ambient temprature i 1 i ! i i / -60 -40 -20 0 20 40 60 80 100 120 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature (?c) ambient temperature (?c) ltlze95a relative luminous intensity vs. forward current (ta=25%) i 1000 9 & x ..$ 8 loo e ; s .- e 3 10 p .- 0 ti oi 1 i nov/10/98 _i 1 forward current vs. forward voltage (~~~25% 1.2 1.7 2. 2 forward voltage va(v) 2.7 relative luminous intensity vs. ambient temorature rte)above characteristic data are typical data and not a gtuanted data. zgize
page 4 characteristics diagrams ltlzv95a ltlzs95a relative luminous intensity vs. forward current relative luminous intensity vs. forward current 1000 1 0.1 1 10 loo forward current ir(rna) i j / 0.1 1 10 loo forward current idma) forward current vs. forward voltage (ta=25q forward current vs. forward voltage (t&s% 100 t i i i / i vi i j j i / i / / i i i i i i 1 i 1.1 2.2 forward voltage v,(v) 1.7 2.2 forward voltage vr(v) relative luminous intensity vs. ambient temprature relative luminous intensity vs ambient temprature loo0 i / i i i j / z .- 3 i i 2 10 -60 -40 -20 0 20 40 60 80 100 120 ambient temperature (?c) -60 -40 -20 0 20 40 60 80 100 120 ambient temperature (?c) ;note)above characteristic data are typical data and not a guranted data.
i dg98900 1 i nodlo/ f-> i: -mt3deb~o... .:?:------ ------ ___. page .?i i * -- ,, 1.: . . ltlzr95a set& .., 3 ;-?x -.. 4 characteristics diagrams ltlzj95a relative luminous intensity vs. forward current (ta=25%) 1000 forward current i&a) 100 forward current vs. forward voltage (~~~25% 1.7 2.2 forward voltage vr(v) 2. 7 relative luminous intensity vs. relative luminous intensity vs. ambient temprature ambient temprature 1000 1000 ?;; r x .z 2 e .- 2 100 s .- e 3 z .- 3 d? 10 -60 -40 -20 0 20 40 60 80 100120 ambient temperature (?c) ii / i i -60 -40 -20 0 20 40 60 80 100 120 ambient temperature (?c) ltlzr95a relative luminous intensity vs. forward current (ta=25?c) 0.1 1 10 forward current i,(ma) loo loo forward current vs. forward voltage (ta=25?c \ ll 0.1 1.2 1.7 2.2 2. 7 forward voltage vr(v) se)above characteristic data are typical data and not a gurattted data. zjizr
i characteristics diagrams ltlzr95a series peak forward current derating curve 120 100 100 80 80 60 60 40 40 20 20 0 0 -25 0 25 50 75 loo 125 ambitent temprature ta(?c) 60 forward current derating curve -25 0 25 50 75 100 125 ambitent temprature ta(?c) 125 peak forward current vs duty ratio(ta=2s?c) )te)above characteristic data are typical data and not a guranted data, duty ratio dr
5. reliability the reliability of products shall be satisfied with items listed below. 5-1. test items and test conditions(in accordance with jis 7021) confidence level: 90s test items test conditions samples (n) ltpd defective (c) (%) temperature cycling -55?c(30min)--+110?c(30min),100cy n=22, c=o 10 high temp. and high humidity storage ta=+85?c, 85%rh, t=loooh n=22, c=o 10 high temperature ta=(tstg-maximum ratings),tzloooh storage n=22, c=o 10 low temperature storage ta=(tstg_minimun ratings),t=loooh n=22, c=o 10 operating test ta=25cc,ir=(ir~maximum ratings),t=loooh n=22, c=o li, mechanical shock 15 ooom/s?, 0.5ms, 3times i *x,+y,*z direction n=ll, c=o 20 variable frequency 200mis2, 100-2 ooo-ioohu?sweepfor 2omin., vibration 4timeslx,y,z direction n=ll, c=o 20 soldering heat refer to the attached sheet, page 14115 1 time n=l 1, c=o 20 5-2. failure judgement criteria (notel) parameter symbol failure judgement criteria (note2) forward voltage vf v, > u.s.l. x 1.2 reverse current ir ir > u.s.l. x 2.0 luminous intensity iv iv > the first stage value x 2.0 or the first stage value x 0.5 > iv (note 1)measuring condition is in accordance with specification. (note2)u.s.l. is shown by upper specification limit.
6. incoming inspection 6- 1. inspection method a single sampling plan, normal inspection level ii based on is0 2859-l shall be adopted. 6-2. describtion of insnection and criteria \lo. inspection items criteria defect aql i electra-optical characteristics not radiation 2 radiation color not correct 3 taping product inserted in reverse direction 4 tape peeling continuous separation of cover tape causing major the product to fall out defect 0.1% 5 label model number is not printed,or misprinted 6 mix another model is mixing 7 quantity wanting quantity in package is wanting 8 luminous intensity not conforming to the specification 9 electra-optical characteristics not conforming to the specification 0 outline dimensions not conforming to the specification 1 label quantity or lot no. is misprinted minor defect 0.4% 2 dust and flaw effect to the specification 3 resin flash 0.3mm or greater from the product *. . . - . . ^. . . . . . ?1 juogement area : i he plated area ot me product bottom and side nov/loi98 ; .: model n& ?--.-. - d i -i1,3 l~l2~95~seiies __ page
7. taping 7-l taping 7- 1 - 1 .shape and dimension of tape(typ.) ----- ----------_ rl % material : carrier tape...ps, cover tape.. . polyester
7-l-2.shape and dimension of reel(typ.) i parameter 1 symbol 1 dimension 1 remarks i idiameter bm(=p.) a b 178 frange thickness t -1.5 i inner space direction w lfl nimnnckn 4 f external diameter r hub spindle hole dim- i width i i i i.0 i -f
dg98900 1 novilol98 ,$-- mmodti -no. - .-. page -j lti?zr95a s&ii - ~---1211_5 :. 7-i-3.taping specification (1) lead tape: end pull out [ > bigining empty stuffed empty leading 10 pith or more ' 10 pith or more (2) cover tape strength against peeling:f=o. i-0.8n( 0 =wor less) cover tape f ae= 0 - lo? uuuuuuuuuuuu~ tape speed : 5mm/s <- forward (3) tape strength against bending: carrier tape the radius of bending circle should be 3omm or more. if it is less than 3omm, the cover may peel. (4) jointing of tape: there should not be joint of cover tape or carrier tape. (5) quantity per reel: average 2,ooopcs. per reel (6) product weight: approx. 0.03 g (7) others: 0 apparent defect of product should not be packed and product should not upset. @ there should not be missing above continuous three products. 0 products should be easily taken out. @ products should not be attached to the cover tape at peeling. 7-2. label for reel lot number *- sharp corporation part no. ltlzr95a + model number q?i^?? ~000 , r g$c);;f?y 1-1 + eiaj c-3 barcode lot no. ka98hol rank aa + luminous rank and dominant wavelength rank h4adein japan + production country t :lot number indication cl00 ~c?c2@0 g 0 c? 77 l&j cg, 0 production plant code(to be indicated alphabetically) @ production lot(single or double figures) @ year of production(the last two figures of the year) @ month of production (to be indicated alphabetically with january corresponding to a) 0 dateofproduction(ol-31)
7-3. dampproof package in other to avoid the absorption of humidity in transport and storage, the devices are packed in aluminum sleeve. label *+ o&f& 6 silicagel q ree1 label 7-3-l.strage conditions temperature : 5 to 30% humidity : less than 6o%rh 7-3-2.treatment after opening (1) please make a soldering within 2 days after opening under following condition; temperature : 5 to 30c humidity : less than 6o%rh (2) in case the devices are not used for a long time after opening ,the storage in dry box is recommendable. or it is better to repack the devices with a desicative by the sealer and put them in the some storage conditions as 7-3- 1. then they should be used within 2 days. (3) please make a soldering after a following baking treatment if unused term should be over the conditions of(2) recommendable conditions: q in taping temprature:60?c to 65?c,time:36 to 48 hours @ in individual (on pwb or metallic tray) temprature: 100c ,time:2 to 3 hours
8. soldering 8- 1 .retlow soldering (1) it is not recommended to exceed the soldering temperature and time shown below. caused by substrate bend or the other mechanical stress during reflow soldering may happen gold wire disconnection etc. therefore please check and study your solder reflow machine?s best condition. (2) reflow soldering temperature protile to be done under the following condition. to be done under the following condition. max 250 nov/10/98 time ls) recommendable thermal model (4) recommendable metal mask pattern for screen print recommend 0.2mm to 0.3mm thickness metal mask for screen print. caused by solder reflow condition, vi solder paste, substrate and the other material etc., 1 ei may change solderbility. please check and study actual solderbility before usage. center of the product r 8-2.manual soldering recommended solder pattern (1) it is recommended to keep the soldering iron temperature at 295c (soldering iron power consumption 20w) and not to solder more than once or for over 3 seconds. (2) when using a soldering iron, care must be taken not to damage the package. (pay attention not to allow any under stress or heat on package.) 8-3. dip soldering method to be done under the following condition. pre-heat temp. : 80 to 120 ?c time : 30 to 120 seconds soldering temp. : max. 260% time : within 5 seconds
9. precautions for use 9-1. precautions matters for designing circuit this product is not designed as electromagnetic and ionized-particle radiation resistant. 9-2. cleaning method (1) solvent cleaning recommend conditions: @ solvent temperature is not more than 45 ?c. @i immersion up to 3 minutes. (2) ultrasonic cleaning the affect on the device from ubrasonic bath, ultrasonic output, duration, board size and device mounting method. test the cleaning method under actual conditions and check for abnormalities before actual use. (3) solvents use only the following types of solvent. water, alcohol, chlorofluorocabon-based solvent when cleaning is necessary. recommend conditions: rt. 4okhz,3ow/l, 3 to 5 minutes io. environment lo- 1. ozonosphere destructive chemicals. (1) the device doesn?t contain following substance. (2) the device doesn?t have a production line whose process requires following substance. restricted part: cfcs,halones,cc&,trichloroethane(methychloroform) 10-2. bromic non-burning materials the device doesn?t contain bromic non-burning materials(pbbos,pbbs)

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